Chips
NEC launches 32-bit MCUs with built-in Ethernet interface
NEC Electronics has developed nine new 32-bit All Flash microcontrollers (MCUs) with built-in Ethernet interface and embedded flash memory. The company informed that the new products are suitable for remote and supervisory control of industrial devices and building-management systems and include six 128-pin variants, named V850ES/JH3-E and three 144-pin variants, named V850ES/JJ3-E. The new products [...]
ST-Ericsson, Nokia in cooperation deal
Nokia and ST-Ericsson are cooperating to provide the Symbian Foundation with a reference platform based on ST-Ericsson’s U8500 single chip. The chip, which combines ST-Ericsson’s application processor and HSPA (High-Speed Packet Access) Release 7 modem, is aimed at enabling the adoption, across the industry, of feature-rich, multimedia 3G Smartphones. The U8500, which relies on the [...]
Picochip launches eight-user HSPA femtocell reference design
Picochip has announced the PC8219, a baseband solution for eight-user WCDMA femtocells designed to run on its PC202 processor chip. Two of Picochip’s lead customers are uderstood to be key development partners for the product. The company has informed that the PC8219 is a complete eight-user femtocell baseband implementation, which is compliant with 3GPP Release [...]
Qualcomm unveils new family of chipset solutions
Qualcomm, a developer of advanced wireless technologies, products and services, has unveiled a new family of chipset solutions that expand its HSPA+ product portfolio. The new HSPA+ products, which include solutions for mobile handsets and data cards, are expected to enable an improved user experience by combining support for advanced mobile broadband technologies with processing [...]
BCD settles patent litigation with Power Integrations
BCD Semiconductor Manufacturing (BCD Semi), an analog integrated device manufacturer specialising in the design, manufacture, and sale of power management integrated circuits, has settled its patent litigation lawsuit with Power Integrations. BCD has maintained that it did not infringe any patents, and is aware that many of the patent claims in the lawsuit are currently under [...]
TI acquires Ciclon Semiconductor
Texas Instruments (TI) has acquired Bethlehem, PA-based Ciclon Semiconductor, a designer of high-frequency analog power management semiconductors. The acquisition is expected to expand TI’s capability to improve energy efficiency in end-equipment designs, including high-power computing and server systems. TI believes that combining Ciclon’s technology with TI’s power management semiconductor portfolio will give the company an [...]
Samsung launches wireless USB SOC solution
Samsung Electronics has announced a new wireless universal serial bus (W-USB) System-On-Chip (SoC) designed specifically for the upcoming ultra-wideband (UWB) market. The latest in its portfolio of mobile technology solutions, Samsung’s W-USB SoC seeks to combine the convenience of wireless connectivity, the security level of wired USB, and the high speed performance of UWB to [...]
Tower, Triune Systems collaborate on power management platform
Tower Semiconductor, a specialty foundry, and Triune Systems, an IC design and test development provider, have announced an agreement to collaborate on developing a power management platform. Through this collaboration, the companies will jointly design and develop intellectual property (IP) for Tower’s 0.18-micron Bipolar-CMOS-DMOS (BCD) process to deliver a family of low and high voltage [...]
SkyCross partners with Infineon for mobile phone architecture
SkyCross, a global antenna solutions company, has partnered with Infineon Technologies to reduce the bill of materials for ultra-low cost handsets. The handset architecture leverages the technical advantages of Infineon chips and SkyCross iMAT antennas to eliminate conventional RF components. This reportedly enables lower cost, simpler integration, and space savings without sacrificing performance. SkyCross surther [...]
Cypress solution selected for SoftBank 931SH mobile phone
Cypress Semiconductor has announced that the Truetouch touchscreen solution from Cypress has been selected to implement the touchscreen for the new Softbank Mobile 931SH mobile phone. The new phone, manufactured by Sharp Communication Systems offers a touchscreen that delivers ‘half-XGA’ (1024 x 480) resolution. It also offers multi-touch capability, allowing gestures such as tap, double-tap, [...]
