Chips
Tessera, Nanium sign packaging technology licensing agreement
Tessera Technologies’ semiconductor packaging subsidiary, Tessera, has signed a technology licensing agreement with Nanium, formerly known as Qimonda Portugal.
Under the agreement, Nanium has licensed Tessera’s semiconductor packaging technology covering a range of chip scale, multi chip and flip chip package types. These technologies include integrated circuit devices packaged in ‘face-down,’ ‘face-up,’ ’stacked-die,’ ‘package on package,’ [...]
NEC introduces EMMA Mobile EV SoCs
NEC Electronics has announced the availability of new systems-on-chip (SoCs) in the EMMA Mobile series.
The company has informed that the EMMA Mobile/EV is capable of processing high-definition (HD) content and 3D graphics with low power consumption. The new SoCs, optimised for the portable device market including portable multimedia players and mobile tablets, integrate ARM’s Cortex-A9 [...]
Dongbu HiTek to manufacture LF receiver ICs for Micro Analog Systems
Dongbu HiTek will manufacture a Low Frequency (LF) receiver ICs for Micro Analog Systems (MAS), a fabless analog semiconductor company based in Espoo, Finland.
Serving as a core component in global radio controlled time-signal application, the LF receiver chips will be manufactured at Dongbu HiTek’s wafer fab using a specialised BCDMOS process at the 0.35-micron node.
This [...]
Samsung develops advanced green DDR3 DRAM
Samsung Electronics, a player in semiconductor technology solutions, has announced that its 30-nanometer-class DRAM (claimed to be the first in the industry) has successfully completed customer evaluations, in two gigabit (Gb) densities.
The company hopes the advancement in process technology will raise productivity and expedite dissemination of high performance, 1.5V and 1.35V DDR3 for servers, desktops [...]
Qualcomm samples new smartphone chipset family
Qualcomm, a developer of wireless technologies, products and services, is sampling a new smartphone chipset family.
The MSM7×30 family lays emphasis on multimedia performance, supporting high-definition video recording and playback, improved graphics with dedicated 2D and 3D cores, and an overall chip design optimised for a responsive Web experience.
The company claims that its MSM7×30 family, which [...]
Vimicro acquires Alcatel-Lucent Shanghai Bell’s ViSS business
Vimicro, a multimedia semiconductor and solution provider, has announced that Vimicro Tianjin, a joint venture company operated and managed by Vimicro, entered into a definitive agreement to acquire Video Surveillance System (ViSS) from Alcatel-Lucent Shanghai Bell (ASB).
Vimicro Tianjin will acquire the complete ViSS business including all property, plant and equipment, inventories, business contracts, intellectual property [...]
Trident to acquire 3 consumer product lines from Micronas
Trident Microsystems, a player in semiconductor system solutions for the multimedia and digital television (DTV) markets, has entered into a definitive agreement with Micronas Semiconductor Holding to acquire selected assets of the frame rate converter (FRC), demodulator and audio product lines of Micronas’ Consumer Division.
The consideration payable to Micronas will consist of 7.0m shares of [...]
Samsung selects Spreadtrum as chipset supplier
Samsung, a player in semiconductor, telecommunication, digital media and digital convergence technologies, has selected Spreadtrum Communications, a wireless baseband chipset provider in China, as a new chipset supplier.
Spreadtrum’s QS520 GSM/GPRS and QS1001 EDGE transceivers have been designed into Samsung’s mobile phone models that are to be shipped internationally. The company has commenced volume shipment of [...]
NXP unveils new DVB-C solution, STB150
NXP Semiconductors, a semiconductor company founded by Philips, has unveiled the new STB150 system solution, delivering a complete production-ready platform for the digital cable TV services market.
The NXP STB150 integrates a new single-chip CX2448x MPEG-2 decoder for DVB-C (Digital Video Broadcasting – Cable) reception with a TDA18252HN silicon tuner and complete software stack, giving cable [...]
Openmoko selects STMicroelectronics’ MEMS solution
STMicroelectronics, a semiconductor company and a supplier of MEMS (Micro-Electro-Mechanical Systems) motion-sensing chips, has announced that its LIS302DL 3-axis accelerometer is being used by Openmoko to provide motion-sensing functions in Openmoko’s Neo Freerunner LINUX-based mobile open platform.
Openmoko is a project dedicated to delivering mobile phones with an open source software stack. The company is currently [...]
